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Google Chip Package Signal Power Integrity Engineer 
United States, California, Sunnyvale 
472829525

25.09.2024
Minimum qualifications:
  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
  • 5 years of industry experience in the SI/PI field.
  • Experience in chip package SI/PI design for interconnections and advanced package design.

Preferred qualifications:
  • Experience in post silicon correlation with models.
  • Experience with 2.5D/3D package design such as silicon interposer, silicon bridge, 3D die stacking.
  • Experience in cross-functional collaboration with chip top design, physical design, STA, package, system design, and validation teams.
  • Experience in programming and data analysis with Matlab, Python, C++ and statistical tools to establish automation flows and data processing.
  • Understanding of on and off chip power delivery and STA/voltage budget.
  • Familiarity with memory testing, next generation memory, chiplet standards and timing budget methodology.