Intel Senior Hardware Engineer 

United States, Texas 

296937615

Job Description:

) is at the forefront of silicon photonics integration and is part ofData Center, connected computing-devicesnearly aand higher speeds from 400G today to 1.6T+ and beyond tomorrow. We are looking forgreat talentto accelerate thisso if you are interested in joining our leadingthen we want to hear from you.

The team is seeking an experienced Hardware Designer with expertise in SI and PI to support the development of reference module designs, PIC sub-system EVB and other test boards to support product development. Demonstrated expertise in designing 100G/lane and 200G/lane module PCBA, lead the layout execution for high-speed traces, power delivery, require extensive experience with designing PDN for high-speed DSP, RFICs, manage PI and SI requirements, actively guide layout engineer and manage tradeoffs in design. The candidate will be expected collaborate with a cross functional product development team - HW, FW, PIC, EIC, Packaging and thermal, Optics and NPI.

Job responsibilities include but are not limited to:

• Perform SI simulations of high-speed interfaces, RF traces, etc. 100Gbps, 200Gbps NRZ and PAM4 signaling.
• Modeling of high speed traces with vias, connectors, sockets and various system components in 3D EM tools like HFSS, ADS.
• Design and optimize Power Delivery Network (PDN) across packages and PCBs.
• Perform PI sims for IR drop, current density violations, dynamic switching noise analysis to validate board designs.
• Expertise in designing 100G/lane and 200G/lane module PCBA, lead the layout execution for high-speed traces, power delivery, require extensive experience with designing PDN for high-speed DSP, RFICs, manage PI and SI requirements, actively guide layout engineer and manage tradeoffs in design.
• Ability to lead hardware design of an optical transceiver and evaluation boards including schematic design, circuit simulation, PCB layout floor planning, design with layout engineer is a plus.
• Lead PCB bring up working with FW engineers to confirm functionality w.r.t design targets. Validate PCB high speed designs thru product design verification tests and independent PCBA characterization. Troubleshoot and optimize performance of thesub-system/transceivermodule boards.
• Extensive experience with selection of DSP, Driver, TIA, uControllers, DACs, ADCs, Voltage regulators, etc.
• Key contributor to Product Requirements, Owns PCBA design from concept phase to full final design and EVT/DVT phase of the product.
• Understand electrical and optical requirements and specifications of optical transceiver MSA. Like 800G DR8/2xFR4, 1.6T DR8/2xFR4, 800G LPO, 1.6T LRO etc.
• Maintain documentation of a hardware design specification, Pass design check list prior to tape out, BOM specifications and work with NPI team to build PCBA. Lead design reviews and present design summary to management, highlight risks with mitigation plans.
• Interface and work collaboratively with mechanical engineers, optical engineers, Photonics engineer, firmware engineers, process engineers and test engineers.
• Interact with program manager, buyer/planner and suppliers to make sure designed parts are available in a timely manner for build and test.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• M.S. in Electrical Engineering
• 4+ years of HW/circuit design experience
• 4+ years of experience in:
  • transceiver electrical design principles, including high speed signal integrity, crosstalk, power integrity, noise, ESD, FW, testing, etc.
  • layout and able to direct layout engineer with clear design priority
  • PI and SI tools (HFSS, ADS, Cadence)
  • high density multiple-layer board design.
  • high volume PCB/substrate fab houses.

Preferred Qualifications

• Ph.D. in Electrical Engineering
• Strong analog and digital circuit design skills and layout with mixed signal designs.
• Experience working with AWG, DCAM, VNA/LCA to characterize high speed performance
• Strong laboratory optical and electrical measurement skills.
• Strong communication and presentation skills.
• Experience with micro-controllers and communication protocols such as SPI, I2C, MDIO, CMIS management interface for optical modules.
• Strong background of digital communication theory.
• Familiarity with industry standards including IEEE Ethernet standards, OIF standards, PCIe standards and various MSAs.
• Experience with optical transceiver test and calibration methodologies.
• Experience working with Marvell, Broadcom, MaxLinear, Credo DSPs in pluggable optical modules.

Experienced HireShift 1 (United States of America)US, California, Santa ClaraUS, Arizona, Phoenix
Position of Trust

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US: 161,230.00 USD - 303,140.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.